Printed Circuit Manufacturing - 'Making Holes Conductive' ( MHC)
Pretreatment, preplate, and electroless copper chemistries suit vertical and horizontal application.
self-acceleration electroless copper technology.
Graphite, and palladium based direct metallization "Conductron" - maximum environmentally
friendly chemistries.
Electrolytic plating
Various copper, tin, tin/lead, nickel, and gold electrolytic processes.
Direct current plaiting ,Periodic Pulse Reverse, Copper electroplating technology for different application.
PWB final finish
Electroless nickel/electroless palladium/immersion gold - lead free universal finishing application for solder ability and Au-wire bonding.
Range of Nickel and Gold plating for PWB and electronic finishing application.
Innerlayer bonding
Innerlayer bonding process with much higher copper loading capacity ( 40-50 g/l) with lower etch rate. Reduced waste from treatment bath.
PWB Primary imaging
Liquid photoresist for different application.
BPR 100 photoresist and chemistry for Wafer Level Packaging manufacturing
Diazo film 7,0 mil- thick polyester-based film coated with special light sensitive
PWB Primary imaging
Dry Film photoresists for conventional and UV laser directly imaging application and Chemistry processes.
Circuit board Equipment
Laminators ,Pre Heaters, Cover Sheet Removers, Vacuum Applicators, Exposure Units,
Handling Unit, Controllers, Special Equipment and new Developments.
Packaging and finishing technologies
Electroplating of Copper & Copper Alloys, Nickel&Nickel Alloys;
Electroless nickel/electroless nickel phosphor free,
Range of plating processe, innovative materials and surface finishing processes for use in electronics, optoelectronics and industrial applications worldwide.
Electroplating Tin and it's Alloys
SoldeRon Series sulphonate based processes for barrel application, high speed wire application, chip production with sensitive ceramic, for semiconductor wafer bump plating.
Plating on Plastic
ABS, polycarbonate, polystyrene, PPO, polyetherimide ( Ultem), polyethersulfonate, polyester
Immersion Tin technology- lead free technique.
Soldermask and Liquid Photoresists
Liquid photoimageable Soldermask and etch resist, series of peelable resist, via plugging resists, thermal curing etch resist for acid and alkaline etching, legend ink,
Silver & carbon conductivity pastes, polymer thick film, electroluminescent inks
Flux for Vertical and horizontal HASL
Flux for Vertical and horizontal HASL application, immersion tin process for Fine-Pitch-technology ;chemical products for PWB industry
Reverse Pulse plating Rectifiers for copper plating processes.
Miniature tools for multilayer ceramic circuit boards (MLC) Blades
Routers, drills, reamers, following steels, counter sinks and graving tools
Lead free solutions
Reflow, Repair soldering and Wave soldering products. Hand / Automatic soldering, Selective soldering, Termical injects. Galvanic, Hot air leveling (HAL).
Lighting Energy Saving, and Voltage Stabilizing.
Dry cabinets for electronic industry
Protect against humidity problems 1% 3% 5% 30% RH. Acrylic and Metallic. Vacuum packing machines.
horizontal wet processing equipment to the PCB industry
In accordance to customer specification. equipment for chemical pre-cleaning, etching ,developing, stripping, metallization, blackening, final coating and automatization of PCB process.
pumps & filters
Filter-media ,hoses ,clamps ,accessories and consulting services to the plating industry
barrel equipment
For electroplating ,variable series of plating drums and aggregates
Hot Air Leveling Systems
Also compatible for lead-free HASL
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Tel: +972(3)5334907
Fax: +972(3)5334412
Email: Mikyr@Lantek.co.il